Panorama Series
Flagship 2D CameraCompoundEye - SharpSeries
Multi-camera array biomimetic design25-megapixel ultra HDUltra-wide field of view
Applications: Large-scene bulk cargo recognition and panoramic monitoring
Perception Layer
Tsingh 2D Smart Camera
High-Precision Recognition Expert
High Precision
Wide Field of View
High Dynamic Range
The Tsingh 2D Smart Camera series delivers high precision, wide field of view, and high dynamic range for warehousing receiving/shipping, sorting, and traceability—addressing slow barcode recognition, tedious manual verification, and disconnected data. High-pixel imaging captures fine details with ultra-clear quality. Compute adapts to different scenario requirements, and precision optics ensure stable, high-quality imaging for all vision applications.
Series Selection Matrix
Flagship · Mainstream · Specialized
WiseEye Series
Mainstream 2D CameraWiseEye - PathFinder Series
Intelligent recognition algorithmsBalanced performanceHigh cost-effectiveness
Applications: AGV / forklift visual navigation, cargo information capture, and label recognition
InstantAnalysis Series
Specialized 2D CameraTsingh - InstantAnalysis Series
Laser-focused designBuilt for speed and stability
Applications: High-speed fixed-line scanning and precision code reading
Product Parameters
Product Parameters
25MP
pixels
1.5m×1.5m
recognition range
≥ 99%
recognition accuracy
| Parameter | Specification |
|---|---|
| Pixels | 25 megapixel |
| Sensor Size | 1.1" |
| Pixel Size | 2.5 um |
| Color/Mono | Monochrome |
| Shutter Type | Global Shutter |
| Resolution | 5120x5120 |
| Frame Rate | 17 FPS |
| Exposure Time | 22 us ~ 11 s 679 ms 335 us |
| Gain Range | Gain: 1.0x-5.0x, Step: 0.5x |
| Spectral Response | 390 nm-1050 nm |
| Bit Depth | 12 bit |
| Image Formats | RAW8, RAW12 (raw image), RAW16, MONO8, MONO16 |
| Trigger Mode | Software trigger, hardware trigger |
| Exposure Mode | Manual exposure, auto exposure, regional exposure |
| Supported Capture Formats | RAW, BMP, JPG, PNG |
| Supported Systems | WinXP 32Bit; Windows 7/8/8.1/10 (32/64Bit) |
Application Scenarios
Application Scenarios
Wafer Inspection System
Solution Design
An integrated solution combining high-precision imaging with deep learning defect detection for chip packaging, PCB processes, wafer production, and other precision scenarios—enabling fully automated, pixel-level robust recognition across the entire workflow.
Product Overview
Designed for full-process wafer quality control in semiconductor manufacturing, this system integrates high-precision optical imaging, AI defect recognition, and micron-level motion control. It enables fully automated, non-contact inspection of wafer surface patterns, film thickness, and defects (scratches, particles, misalignment)—covering all process nodes from lithography and etching to bonding.
Product Highlights
Ultimate Precision, Efficient Full Inspection
Intelligent Analysis, Stable and Reliable
Integrated Hardware and Software, Unlocking Limitless Possibilities
Tsingh smart camera series are far more than simple hardware sensors. With integrated design, broad adaptability, and powerful algorithms, they reinvent structure, algorithms, power, deployment, and cost. Each camera carries 90,000+ algorithm modules—serving as an efficiency engine and data gateway for your operations, delivering end-to-end value.
More Efficient
Full-Dimensional Information Capture
Recognize complex conditions in one pass—simultaneously completing recognition, measurement, and positioning tasks
More Economical
Minimal Deployment, Ready Out of the Box
Integrated embedded design that lowers deployment costs
More Open
Control Back in Your Hands
Powerful SDK for secondary development—empowering your customized requirements
Smarter
Deep Integration with Robotics Systems
Flexibly empowering AS/RS, AGVs, robotic arms, and other terminals
More Autonomous
Full Support for Domestic Chips
Compatible with mainstream domestic chips for seamless ecosystem collaboration